- Samsung Develops 12-Layer 3D TSV DRAM: Up to 24 GB HBM2 AnandTech
- Samsung 3D Stacks 12-Layer HBM2E Chips, Now 24GB of Capacity Tom's Hardware
- Samsung Electronics Develops Industry's First 12-Layer 3D-TSV Chip Packaging Technology Samsung Newsroom US
- Samsung paves the way for 24 gigabyte High Bandwidth Memory ZDNet
- Samsung says its third-quarter profit likely fell 56% from a year earlier CNBC
- View full coverage on Google News
Samsung Develops 12-Layer 3D TSV DRAM: Up to 24 GB HBM2 - AnandTech
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